• Rifeng F - Fine Cell Size PMI Foam Core for Radomes, Antennas, and Telecommunications
  • Rifeng F - Fine Cell Size PMI Foam Core for Radomes, Antennas, and Telecommunications
  • Rifeng F - Fine Cell Size PMI Foam Core for Radomes, Antennas, and Telecommunications
  • Rifeng F - Fine Cell Size PMI Foam Core for Radomes, Antennas, and Telecommunications

Rifeng F - Fine Cell Size PMI Foam Core for Radomes, Antennas, and Telecommunications

Rifeng F is a premium, closed-cell rigid PMI foam engineered with an ultra-fine cell size structure. Specifically optimized for high-frequency telecommunications and aerospace applications, it offers the lowest resin absorption and extremely low dielectric constants. It is the premier choice for radomes, satellite antennas, and mammography plates where maximum signal transparency and weight efficiency are critical.
  • Rifeng F - Fine Cell Size PMI Foam Core for Radomes, Antennas, and Telecommunications
  • Rifeng F - Fine Cell Size PMI Foam Core for Radomes, Antennas, and Telecommunications

Description

Ultra-Fine Cell Size PMI Structural Foam
Rifeng F is a closed-cell rigid foam based on Polymethacrylimide (PMI) polymer, that is completely free of CFC's. It features a Fine Cell Size. With extremely low dielectric constants and particularly favorable transmission properties in the high-frequency region, Rifeng F has been specially designed for antenna applications.


It is the premier core material for aerospace radomes, satellite antennas, and mammography plates. The extremely fine cell size structure ensures minimal resin uptake, which is critical for maintaining signal clarity and reducing weight in high-frequency telecommunications. Additionally, its non-corrosive nature ensures problem-free compatibility with metallic facing materials.

Processing and Production
Rifeng F core materials are highly adaptable and can be processed using hand lay-up, prepreg, or vacuum infusion techniques. It maintains structural stability at pressures up to 0.35 MPa and curing temperatures ranging from 130°C to 150°C.


Maximum Weight Saving and Signal Clarity
When building composite sandwich components, the closed-cell structure of Rifeng F ensures resin stays at the interface. By eliminating excess resin penetration, it minimizes undesirable "dead weight," making it the ideal choice for weight-critical radomes, antennas, and communication structures.


Thermoforming and Shaping
Rifeng F can be easily thermoformed or CNC machined to meet customer requirements. We provide high-precision, pre-shaped, and ready-to-use foam cores in simple or complex geometries.


Mechanical Properties (Typical Values)

Property

Test Method

Unit

Rifeng 32F

Rifeng 52F

Rifeng 75F

Rifeng 110F

Density ISO 845 Kg/m3 32±7 52±10 75±15 110±20
Compressive Strength ISO 844 MPa 0.40 0.90 1.60 2.25
Tensile Strength ASTM D638 MPa 0.95 1.90 2.50 3.30
Elastic Modulus ASTM D638 MPa 35 75 95 185
Elongation at Break ASTM D638 % 2.6 2.8 3.0 3.6
Flexural Strength ASTM D790 MPa 0.60 1.60 2.85 4.50
Shear Strength ASTM C273 MPa 0.40 0.90 1.30 2.25
Shear Modulus ASTM C273 MPa 12 25 40 60
Heat distortion resistance DIN 53424 ≧200 ≧200 ≧200 ≧200

Sales range for Rifeng F Grade

Rifeng F Grade Size (mm) Thickness (mm)
32 F 2500 x 1250 1~80
52 F 2500 x 1250 1~110
75 F 2500 x 1250 1~90
110 F 2160 x 1100 1~65

Premier Choice for Aerospace Radomes
Rifeng F provides the lowest dielectric constant and minimal resin uptake, ensuring maximum signal transparency for aircraft and satellite radome parts.

Optimized for Telecommunications
Engineered for minimal attenuation, this fine cell size PMI foam is the standard core for antennas ranging from miniature cell phones to large fixed stationary antenna structures.

Superior Surface Quality for Precision Bonding
The ultra-fine cells produce an exceptionally smooth surface after machining, providing a perfect interface for bonding and reducing dead weight from excess resin.

Product Advantages

  • Ultra-Fine Cell Size Technology: Industry-leading low resin absorption for maximum weight efficiency.
  • Exceptional Dielectric Properties: Ideal for high-frequency telecommunications and antenna systems.
  • Non-Corrosive Compatibility: Problem-free integration with metallic facing materials.